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CEO of HPSP.
Lee Choon-heung
Intel-Backed Packaging Expert Eyes Global Dominance
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Last Updated on Jun 17, 2026
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CEO of HPSP.
Life Summary
Lee Choon-heung is the CEO of HPSP.
He is regarded as one of the world's leading experts in semiconductor packaging and is focused on strengthening the company's dominance in the global market.
He was born on November 15, 1958.
He graduated from Jangchung High School in Seoul and earned a bachelor's degree in Physics from Korea University.
He received a master's degree in Physics from the graduate school of Korea University and went on to earn both a master's degree and a Ph.D. in Theoretical Solid State Physics from Case Western Reserve University in Ohio, United States.
He served as Head of the Technology Research Institute at Amkor Technology Korea before moving to Amkor Technology's U.S. headquarters, where he worked as CTO and Vice President in charge of overseas manufacturing operations. In 2015, he was appointed President and CEO of Amkor Technology Korea.
He later served as AP Global CTO at Lam Research, Global CEO of JCET Group, and Global CTO of JCET StatsChipPac.
He was selected as Corporate Vice President and Senior Vice President (SVP) in charge of package and test technology development at Intel, and was recruited as CEO of HPSP in November 2025.
He holds 38 semiconductor packaging-related patents in Korea and 21 patents in the United States under his own name.
He also served as Chairman of the Incheon Semiconductor Forum.
#HPSP #LeeChoonheung #SemiconductorPackaging #Intel #AmkorTechnology #LamResearch #JCET #StatsChipPac #SemiconductorIndustry #GlobalCTO
He is regarded as one of the world's leading experts in semiconductor packaging and is focused on strengthening the company's dominance in the global market.
He was born on November 15, 1958.
He graduated from Jangchung High School in Seoul and earned a bachelor's degree in Physics from Korea University.
He received a master's degree in Physics from the graduate school of Korea University and went on to earn both a master's degree and a Ph.D. in Theoretical Solid State Physics from Case Western Reserve University in Ohio, United States.
He served as Head of the Technology Research Institute at Amkor Technology Korea before moving to Amkor Technology's U.S. headquarters, where he worked as CTO and Vice President in charge of overseas manufacturing operations. In 2015, he was appointed President and CEO of Amkor Technology Korea.
He later served as AP Global CTO at Lam Research, Global CEO of JCET Group, and Global CTO of JCET StatsChipPac.
He was selected as Corporate Vice President and Senior Vice President (SVP) in charge of package and test technology development at Intel, and was recruited as CEO of HPSP in November 2025.
He holds 38 semiconductor packaging-related patents in Korea and 21 patents in the United States under his own name.
He also served as Chairman of the Incheon Semiconductor Forum.
#HPSP #LeeChoonheung #SemiconductorPackaging #Intel #AmkorTechnology #LamResearch #JCET #StatsChipPac #SemiconductorIndustry #GlobalCTO